SHTITECH treats material, machine, process settings and post-processing as one application system rather than independent catalogue items.
Standard, model, durable and application-specific resin categories may be available depending on the selected SLA / DLP / MSLA system. Current uploaded reference material includes NextShapes 8001 photopolymer resin; global chemical and use requirements must be checked for the intended supply scope.
PLA, PETG, ABS/ASA, polyamide, PC and higher-temperature polymers/composites may be relevant depending on the printer. Compatibility is confirmed against the final machine and material datasheet.
PA11 / PA12 and other polymer powder pathways are application dependent. Powder refresh rates, storage, humidity control, recovery and operator handling are part of the system review.
Supplier literature for current reference platforms lists titanium alloys, stainless steel, CoCr and high-temperature alloy pathways on selected models. Material availability and process parameters require project confirmation.
Washing, curing, support removal, depowdering, blasting, heat treatment, machining and surface finishing may be required depending on the process.
Chemical, powder and waste handling must follow the applicable SDS and relevant applicable workplace, environmental and site requirements. SHTITECH does not represent every material as approved for every application.